Surfaces

General Informations

Overview and selection

The PCB surface (final surface, metallization, finish) has the task of protecting the copper of the connection surfaces from oxidation and making it durable for a sufficient period of time to be able to reliably carry out the intended assembly and connection technology (AVT).

Today, connection techniques go far beyond soldering. In addition to the solderability of the surfaces, other requirements must often be met. The following techniques are used:

 

Surface Soldering US-Bonding (AI) TS-Bonding (Au) Conductive Bonding Press-Fit Technology CIF-Connector Connector Strips Sliding Contacts Inching Contacts Crimping RoHS-Compliance
Tin
Immersion Tin

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HAL SnCuNi

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HAL SnPb

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Immersion Ni/SnPb (Ni/Tin Pad)

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Gold

Immersion. Ni/Au (ENIG)

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+

+

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Immersion Ni/Pd/Au (ENEPIG)

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electroless Pd/Au (EPIG)

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electroless Ni/Reduktiv-Au

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electroplated Ni/Finegold

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electroplated Ni/Hard Gold

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Silver
Electroless Silver

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ISIG (former ASIG)

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electroplated Silver

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Copper
Bare Copper

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+

+

OSP

+

+

Carbon Print

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Further Informations

Types of Surfaces

Here you can get more detailed information about the individual surface types:

If you have any further questions regarding the surfaces of printed circuit boards, please do not hesitate to contact our technology manager Dr. Lehnberger: