Range of Services: Power Printed Circuit Boards

The technical parameters listed here are intended as a first orientation for the ANDUS range of services.

Do you have different requirements? We turn your ideas into reality!
Your ANDUS contact persons will be happy to provide comprehensive advice: from material selection all the way to the completed circuit board.

You can also get detailed informations in advance on our Technology CD Online.


Maximum Measurements
 MAXIMUM MEASUREMENTS
 Format   Length 520 mm / Width 535 mm
 Length 470 mm / Width 575 mm
 Thickness  up to 8 mm

Construction
 CONSTRUCTION
 Example
 Construction
 
   High currents and Power losses
 Power &
 Currents
 
Thick copper
 
Iceberg technique

Inlays, single layered (Busbars) 

Inlays, multilayered 

X-Cool 

Leadframe technique 
  Thick copper selektive Thick copper (Iceberg technique) Inlays, single layered (Busbars) Inlays, multilayered X-Cool High Current PCB Leadframe
technique
   Electronics cooling and High temperature
 Power &
 Cooling

 IMS-PCBs

 Flex on Alu
 
Copper heatsink
 
X-Cool, single sided

 Metal core PCB

 Copper-Invar-Copper (CIC)
  IMS PCBs Flex on Alu Copper heatsink X-Cool, single sided Metal core PCB Copper/
Invar/
Copper (CIC)

 
Materials
 MATERIALS
 FR-4  Our Standard:
 Panasonic:
R1755M
 Isola: DE104
 HT Material  Nelco 4000-13
 RO4003, RO4350
 Polyimide-Glass
 LCP
 PTFE (Teflon)
 Copper  up to 3 mm
 
Technologies
 TECHNOLOGIES
 Thick copper technique
 Pattern leveling
 Selektive Thick copper (Iceberg technique)
   Inlays (Busbars)
 Copper filled Micro vias
 Screw connects
 X-Cool
   Leadframe technique
 IMS
 Heatsink
 Metal core PCBs
   Copper/Invar/Copper (CIC)