Range of Services: Multilayer Printed Circuit Boards

The technical parameters listed here are intended as a first orientation for the ANDUS range of services.

Do you have different requirements? We turn your ideas into reality!
Your ANDUS contact persons will be happy to provide comprehensive advice: from material selection all the way to the completed circuit board.

You can also get detailed informations in advance on our Technology CD Online.


Maximum Measurements
 MAXIMUM MEASUREMENTS
 Format   Length 470 mm / Width 575 mm
 Length 520 mm / Width 535 mm
 Thickness  0.3 mm - 8 mm

Construction
 CONSTRUCTION
 Number of
 Layers    
 up to 30 Layers 
 Example
 Construction
    
 Multilayer 4 Layers 6 Layers 8 Layers 10 Layers 12 Layers 14 Layers

 4 Layers Multilayer

 6 Layers Multilayer

 8 Layers Multilayer

 10 Layers Multilayer

 12 Layers Multilayer

 14 Layers Multilayer
 Core  1x 0,96 mm  2x 0,41 mm  3x 0,3 mm  4x 0,2 mm  5x 0,15 mm  6x 0,1 mm
 Prepreg   2x 2 2116  3x 2 1080  2x 2 1080
 2x 1 1080
 3x 2 1080
 2x 1 1080
 6x 1 2116  7x 1 2116
 Copper
 inside
 18 µm  18 µm  18 µm  18 µm  18 µm  18 µm
 Copper
 outside
 18 + 35 µm   18 + 35 µm   18 + 35 µm  18 + 35 µm  18 + 35 µm  18 + 35 µm
  
 HDI
 Construction

 HDI-
 Multilayer

 HDI-Multilayer: Micro vias, Buried vias

 HDI-Multilayer: plugged Micro vias

 HDI-Multilayer: Plugging, Via in Pad

 HDI-Multilayer: Semi buried vias

 HDI-Multilayer: Backdrill

 HDI-Multilayer: Embedded Components & Fluids
  Micro vias, Buried vias plugged Micro vias & Buried vias Plugging,
Via in Pad
Semi buried vias Backdrill Embedded Components & Fluids
 
 
Materials
 MATERIALS
 FR-4  Our Standard:
 Panasonic:
R1755M
 Isola: DE104
 Copper  5 - 105 µm
 
Technologies
 TECHNOLOGIES
 Standard  Vias from 0.2 mm
 Blind hole drilling, Blind vias
 Plugging
 Edge contacts
 Milling from 0.6 mm
 Depth milling
 Scoring
 Countersinking
 Laser cutting
 HDI  Micro vias
 Copper filled Micro vias
 Stacked Micro vias
 Buried vias
 Plugging
 Semi buried vias