Design Rules: Multilayer Printed Circuit Boards

 Measurement  Description Value [µm]
 Std. / Advanced / Limit  
 Designrules
Designrules
 
  
 
  Conductor Width, Conductor Space



  
  Clearance Conductor-Pads
 
 

  Cu                   Space, Width
  5-12 µm           125 / 100 / 50
  18 µm              125 / 100 / 60
  35 µm              150 / 125 / 85 
  70 µm              250 / 200 / 175
  105 µm            500 / 300 / 250

 Designrules
 
  Distance Via-Via
 
  450 / 375 / 300

 Designrules
 
  Plated Through Holes








  Buried Vias
 
  PCB Thickness    Via Diameter
  1,0                     0,3 / 0,2 / 0,1
  1,6                     0,3 / 0,2 / 0,15
  2,0                     0,4 / 0,25 / 0,2
  2,4                     0,5 / 0,3 / 0,25
  3,2                     0,6 / 0,4 / 0,3

  Annular Ring       150 / 125 / 100

  Same design rules, PCB thickness
  corresponds to lenghts of buried vias

 Designrules  
  Microvias
 
  Diameter            100 / 100 / 100
  Annular Ring       100 / 75 / 75
  Depth                 80 / 100 / 120
 Designrules
Designrules
 
  Clearance Via-Inner Layer
 
  Via-Inner Layer   300 / 250 / 250





  Clearance Supply Planes
                           200 / 150 / 125

 Designrules
 
  Clearance Copper-Outline
 
  300 / 250 / 200

 Designrules
 
  Solder Mask
 
  Clearance                100 / 75 / 50
  Solder Mask Bridge   150 / 100 / 75