Multilayer PCBs

In combination with HDI technology, processing techniques such as microvias, blind vias and buried vias, fascinating new possibilities for innovative customer solutions arise.

General Informations

Manufacturing Capabilities

At ANDUS ELECTRONIC we offer high quality PCBs and service from one source. You can send us your data and receive directly a non-binding offer! With over 50 years of experience in PCB manufacturing in Germany, we are able to meet all customer requirements.

The table shows you a selection of possibilities with the different materials, technologies and tolerances we provide. Of course we always respond to your special requests, just contact us!

Maximum dimensions
Number of Layers
1 - 40 Layers
Prototypes till Serial production
Minimum drill diameter
Copper Thickness
9µm - 3mm
Appointment Options
2 - 15 Working Days
Chem. Ni/Au , HAL lead-free, HAL SnPb, Chem. Silver, Galvanic Ni/Au, ENEPIG

For a complete list of our flex PCB fabrication capabilities, please refer to our capabilities section.

Further Informations

Possible Applications

The application possibilities of multilayer printed circuit boards are almost unlimited.

Projects in which we were allowed to support our customers in the last 50 years were for example:

  • Synchrotron – evaluation electronics for scientific research in the field of particle physics
  • Embedded system for medical technology
  • Unbundling of large BGA processors for digital projectors in 3D cinemas

More Details

Quality Assurance

At ANDUS Electronic you receive printed circuit boards in best industrial quality of course directly from the PCB manufacturer.

ANDUS manufactures all printed circuit boards according to the guidelines IPC-A-6012/6013 as standard in the

IPC Class 2 = Electronics with increased reliability requirements
For applications in the medical technology, aerospace, military technology or similar industries with vital or safety-relevant
electronic assemblies, we also manufacture according to

IPC Class 3 = Electronics with high reliability requirements, e.g. safety-relevant
systems, even under harsh environmental conditions

For this purpose we carry out the following tests:

  • Micrograph analysis
  • Solderability
  • Heat stress (solder shock test)
  • Delamination test
  • Layer thickness measurement (X-Ray)
  • Impedance control (TDR measurement method)
  • Measurement of mechanical dimensions
  • Initial sample test reports
  • Preparation of CoC`s
  • E-Test up to 500V