Design Rules: Power Printed Circuit Boards

in addition to the Design Rules for Multilayer PCBs

Measurement  Description Value [µm]
 Std. / Advanced / Limit  
 Designrules    
  Conductor Width, Conductor Space











  Inlay Thickness
 
 
  Cu                Space, Width
  70 µm            250 / 200 / 175
  105 µm          500 / 300 / 250
  210 µm          800 / 600 / 500 
  210 µmE        400 / 300 / 250
  400 µm        2000 / 1500 / 1200
  400 µmE      1000 / 750 / 600
  > 800 µm (Inlay) 3.5 mm/2 mm/ 1.5 mm*

  (E) Iceberg Technique
   *  Only limited area

  0.8 mm, 1.0 mm, 1.5 mm
  2.0 mm, 2.5 mm, 3.0 mm


 Designrules
 
  Diameter




  Annular Ring
 
  Cu                 Diameter
  210 µm          500 / 400 / 300
  400 µm          700 / 600 / 500
  > 800 µm   > 1500 / 1000 / 800

  Cu                 Annular Ring
  70 µm            250 / 200 / 150
  105 µm          300 / 250 / 175
  210 µm          400 / 350 / 225
  400 µm          600 / 550 / 325
  > 800 µm (Inlay) 800

Designrules  
  Distance of Drills through Inlays







 
 
  800 / 500 / 400

 Designrules
 
  Clearance Copper-Outline
 
  > 800 µm (Inlay) 2000 / 1500 / 1000
 Designrules  
  Distance Via-Inlay
 
  1000 / 800 / 500

 Designrules
 
  Distance Inner Layer-Inlay
 
  800 / 600 / 500