Further technologies
Additionally, we can equip your rigid, flexible, radio frequency and thermal PCBs with further technologies. If you need a special solution you cannot achieve with the options mentioned below, please get in touch with us. We are looking forward to developing and implementing new ideas with you.
| Special technologies: |
CIC: copper-invar-copper
preparatory work for assembly (adhesive, protective covers, …)
conductive carbon finish
edge plating
edge contacts
embedded components/passives
processing new material
|
| CNC technologies: |
drilling, scoring, milling
laser-cutting
depth milling, plated through and non-plated through
counter-sinking
staggered plated-through holes
backdrilling
|
| Design and layout service: |
layout development
layout design for rigid-flex
impedance calculation
netlist comparison
re-formatting to Gerber data
reproduction of single-sided and double-sided PCBs
film and reproduction service
|
| Thermal management: |
current load capacity determination
design of high-performance boards
thermal simulation service
|
| Assembly and application: |
template service
assembly service
thermographic support
|
| QS service: |
surface analysis
first sample test report
non-conformity report
ESD packaging
electric test up to 500 V
COC, IPC class 2, 3 |
