PCB Surface Finishes

The PCB surface serves to prepare the connecting faces for the intended packaging method and to make them storable. Today, the packaging method often goes far beyond soldering.

The following technologies are used:

  • soldering, often several times and lead-free
  • US bonding (ultra sonic, with aluminium wire, thick wire or tapes as well as
    gold stud bump bonding)
  • TS bonding (thermo sonic bonding, with gold wire)
  • conductible adhesives
  • press-fitting
  • ZIF socket (zero insertion force socket)
  • direct connector/edge connector/multipoint connector
  • push contacts, sliding contacts
  • crimping
  • bar soldering with tin-lead solder deposit


The following surfaces are available:

   Surface  Löten   US-Bonden Golddraht   TS-Bonden Aluminiumdraht   Leitkleben   Einpresstechnik   CIF-Stecker Nullkraftstecker   Steckerleisten   Schleifkontakte   Tippkontakte   Crimpen   RoHS-konform 
 Zinn   immersion tin dot     dot dot dot         dot
 HAL SnPb dot       dot            
 HAL SnCuNi dot       dot           dot
 solder depot dot                    
 galv. Ni/SnPb dot       dot            
 Gold   ENIG dot dot   dot dot dot dot dot   dot
 EN/imm. thick gold   dot dot dot dot dot           dot
 galv. Ni/fine gold   dot dot dot             dot
 galv. Ni/hard gold       dot   dot dot dot dot   dot
 Sonstiges   imm. silver dot dot     dot         dot
 ASIG dot dot dot dot dot dot dot       dot
 galv. silver         dot   dot       dot
 bare Cu dot                 dot dot
 OSP dot                   dot
 carbon print                 dot   dot



In spite of the wide range of surfaces available today, most PCBs are made with the universal surfaces immersion tin and ENIG.