Further PCB Technologies

Additionally, we can equip your rigid, flexible, radio frequency and thermal PCBs with further technologies. If you need a special solution you cannot achieve with the options mentioned below, please get in touch with us. We are looking forward to developing and implementing new ideas with you.

Special technologies:

                         •  CIC: copper-invar-copper for expansion control
                         •  preparatory work for assembly
                            (adhesive, protective covers, …)
                         •  conductive carbon finish
                         •  edge plating
                         •  edge contacts
                         •  embedded components/passives
                         •  processing new material

CNC technologies:

                         •  drilling, scoring, milling
                         •  laser-cutting
                         •  depth milling, plated through and non-plated through
                         •  counter-sinking
                         •  staggered plated-through holes
                         •  backdrilling

 Design and layout service:

                         •  layout development
                         •  layout design for rigid-flex
                         •  impedance calculation
                         •  netlist comparison
                         •  re-formatting to Gerber data
                         •  reproduction of single-sided and double-sided PCBs
                         •  film and reproduction service

Thermal management: 

                         •  current load capacity determination
                         •  design of high-performance boards
                         •  thermal simulation service

 Assembly and application:

                         •  template service
                         •  assembly service
                         •  thermographic support

 QS service:

                         •  surface analysis
                         •  first sample test report
                         •  non-conformity report
                         •  ESD packaging
                         •  electric test up to 500 V
                         •  COC, IPC class 2, 3